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Laser scribing is a technique that allows for easy singulation of substrates or materials . As opposed to laser cutting, the laser beam does not go all the way through the material during a laser scribing process and the goal is to make a scribed line along which an easy and clean break out can be done.
In essence, small (<100um) blind lines are scribed by laser to create a weak spot in the material. The width of the lines is quite small even cannot be seen.
Laser scribing is often used to prepare the substrate to be easily singled out after being printed or assembled. This way, no expensive equipment is needed by the party that assembles and you also avoid any difficulties with cutting in the process by avoiding the risk to damage other components using high-power/temperature lasers.
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