Laser perforation is a laser processing technology that uses a pulsed heat source with high power density and a short stay (lower than laser cutting) for perforating. The formation of the aperture can be achieved by a single pulse or multiple pulses. Compared with traditional perforation technologies such as mechanical perforation, electrochemistry and electric spark discharge, laser perforation is a more economical perforation technology when processing small holes. Although the laser heat source based on the cutting design can also be used for perforating, it is more effective to use the laser heat source based on the perforating design at work. At the same time, this high-power, repeatable pulsed laser can realize laser cutting by processing a series of closely connected small holes. Generally speaking, the diameter of laser perforation is generally between 0.075 and 1.5 mm.

Advantages of laser perforation:

1.Fast perforating  time

2.Strong automation adaptability

3.Can be used for penetration processing of difficult-to-open materials

4.Compared with mechanical perforation, there is no mechanical wear in any form between the perforation process and the workpiece