Laser kiss cutting allows to cut the top layer of a material without cutting through an attached material. A typical application is laser kiss cutting sticker labels. By using the right settings, the label can be cut without cutting the backing material like an adhesive foil. Typically, C02 lasers are used for kiss cutting applications. Laser kiss cutting can also be combined with perforating or “through cutting” on a single application. 

With a laser you can do all in one process: engrave, kiss cut and perforate or cut through. 

A cost effective process with low operating and material costs and high flexibility: 

• Virtually unlimited cutting path. The laser beam can be moved in any direction in 2D, unlike other processes that use knives or saws. 

• Sticky materials that would otherwise adhere to a blade can be kiss cut.

 • Very hard or abrasive materials can be kiss cut. 

• High speed cutting with accuracy. 

• Digital process, no expensive dies required.